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2011年4月26日星期二

Rivet Manufacturing Flaw Suspected in Jet’s Roof

The National Transportation Safety Board, in an interim report, said that a laboratory examination of intact sections of the roof found that rivet holes on one layer of the plane’s skin did not line up properly with an underlying layer. The board also said that it found paint from the exterior of the plane had bled through into the inside. Experts said that suggested the aluminum skin had not been properly bound together, leading to premature damage from fatigue.


The board, as is its practice, did not draw any conclusions about the cause of the rupture, which occurred at 34,000 feet. It will not do so until research is complete and its five members receive a report from the staff, something that will probably not happen for months. But outside experts said that the 15-year-old Boeing 737 probably left the factory with flaws.


“It means the assembly was wrong, it means the wrong tools were used, it means they were careless in drilling the holes, and maybe the drill was dull,” said John J. Goglia, an aircraft maintenance expert who is a former member of the safety board.


Robert W. Mann Jr., an aviation industry expert in Port Washington, N.Y., said such flaws were unusual. “The key issue is whether this was systemic,” he said. “ Why weren’t the parts rejected?”


Boeing, in a statement, said it would not speculate about the cause of the incident but that “we remain fully engaged with the investigation.”


The safety board said it was also examining the five other Southwest planes that were found to have cracks. Those five planes and the one that ripped open all had about 40,000 cycles of takeoffs and landings. After the Southwest incident, Boeing said it did not expect that these models of 737s needed to be inspected before at least 60,000 cycles.


In an emergency order days after the incident, the Federal Aviation Administration ordered airlines flying those planes to check for cracks at 30,000 cycles.


The six planes were delivered by Boeing from 1994 to 1996. Boeing said it had completed a worldwide inspection of nearly 80 percent of 190 similar 737s and found no other problems.


An F.A.A. official involved in the investigation, who asked not to be identified because the agency had not taken a formal position, said it was too soon to know whether the agency’s inspection order would have detected bad riveting. But the official added that the results of that inspection did not show that there was any generic problem. In fact, it was possible that the Southwest airplane had a one-of-a-kind problem, the official said.


If the rivet holes on the two pieces of aluminum being fastened together did not line up right, that would mean they were egg-shaped instead of round, Mr. Goglia said. As the two pieces of metal were pulled in opposite directions when a plane is pressurized and depressurized, round holes would spread the forces evenly around the circumference of the hole. But if the hole is egg-shaped, he said, “they’re concentrated in one spot.”


The aviation industry is well acquainted with cracks developing around rivets as airplanes age. In April 1988, an Aloha Airlines plane peeled open almost like a sardine can, resulting in new inspection requirements. But that plane had 89,000 takeoffs and landings.


Hans J. Weber, owner of Tecop International, an aviation consulting firm in San Diego, said that manufacturing flaws were rare. “This is a real puzzle,” he said. “I am not fully satisfied with the explanation. The manufacturing of aluminum airplanes is very well understood.”


Mr. Mann said he was concerned about the paint. “These are not small defects that you could have wicking of the liquids,” Mr. Mann said. “Paint is not a thin substance. It is pretty substantial.”


If the parts were not the perfect shape as they came to the manufacturing plant, “that creates the necessity to redrill, which creates the ovalization,” Mr. Mann said, leading the parts to wear.


Analysts pointed out that there had been several problems in 1990s with planes that had been miswired or misassembled.


With major manufacturers like Boeing, the F.A.A. usually uses company employees to act as its designee in carrying out inspections, although it intermittently reviews their work. Mr. Mann said that in effect, “the F.A.A. designates the manufacturer as their own judge and jury.”


Matthew L. Wald reported from Washington and Jad Mouawad from New York.


 

2011年4月15日星期五

Intel and Micron announce new 20nm NAND Flash manufacturing process

Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process

New 20nm, 8-gigabyte Device Delivers Highest Capacity in Smallest Form Factor for Tablets, Smartphones, SSDs and Other Consumer and Compute Devices


NEWS HIGHLIGHTS


* Intel and Micron deliver industry's smallest, most advanced NAND flash process technology at 20nm.
* IM Flash Technologies leads the industry with 20nm process and quick transitions of the entire fab network.
* Measuring just 118mm2, the 8GB MLC NAND device provides high capacity for smartphones, tablets, SSDs and more.


SANTA CLARA, Calif. & BOISE, Idaho--(BUSINESS WIRE)--Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).


"Our goal is to enable instant, affordable access to the world's information"


The growth in data storage combined with feature enhancements for tablets and smartphones is creating new demands for NAND flash technology, especially greater capacity in smaller designs. The new 20nm 8GB device measures just 118mm2 and enables a 30 to 40 percent reduction in board space (depending on package type) compared to the companies' existing 25nm 8GB NAND device. A reduction in the flash storage layout provides greater system level efficiency as it enables tablet and smartphone manufacturers to use the extra space for end-product improvements such as a bigger battery, larger screen or adding another chip to handle new features.


Manufactured by IM Flash Technologies (IMFT), Intel and Micron's NAND flash joint venture, the new 20nm 8GB device is a breakthrough in NAND process and technology design, further extending the companies' lithography leadership. Shrinking NAND lithography to this technology node is the most cost-effective method for increasing fab output, as it provides approximately 50 percent more gigabyte capacity from these factories when compared to current technology. The new 20nm process maintains similar performance and endurance as the previous generation 25nm NAND technology.


"Close customer collaboration is one of Micron's core values and through these efforts we are constantly uncovering compelling end-product design opportunities for NAND flash storage," said Glen Hawk, vice president of Micron's NAND Solutions Group. "Our innovation and growth opportunities continue with the 20nm NAND process, enabling Micron to deliver cost-effective, value-added solid-state storage solutions for our customers."


"Our goal is to enable instant, affordable access to the world's information," said Tom Rampone, vice president and general manager, Intel Non-Volatile Memory Solutions Group. "Industry-leading NAND gives Intel the ability to provide the highest quality and most cost-effective solutions to our customers, generation after generation. The Intel-Micron joint venture is a model for the manufacturing industry as we continue to lead the industry in process technology and make quick transitions of our entire fab network to smaller and smaller lithographies."


The 20nm, 8GB device is sampling now and expected to enter mass production in the second half of 2011. At that time, Intel and Micron also expect to unveil samples of a 16GB device, creating up to 128GBs of capacity in a single solid-state storage solution that is smaller than a U.S. postage stamp.


About Micron


Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology Inc., visit www.micron.com.


About Intel


Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.


Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.


* Other names and brands may be claimed as the property of others.


?2011 Micron Technology, Inc. and Intel Corporation. All rights reserved. Information is subject to change without notice.


Micron and the Micron logo are trademarks of Micron Technology, Inc. This news release contains forward-looking statements regarding the production of the 20nm, 8GB and 16GB NAND device. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.